QUALCOMM CDMA Technologies Extends Product Roadmaps to Support Multiple Modes of Third Generation Global CDMA Standard / New Solutions to Support Multi-Carrier
11.10.1999, 10:29
GENEVA (PROTEXT) - QUALCOMM Incorporated (Nasdaq: QCOM),
pioneer and world leader of Code Division Multiple Access (CDMA)
digital wireless technology, today announced further development
plans for Mobile Station Modem (MSM(TM)) solutions that will
support the single worldwide CDMA standard for third generation
(3G) systems. The new chipset and system software solutions will
support the Frequency Division Duplex (FDD) modes of the Global
3G (G3G) CDMA air interface standard in accordance with the
Operator's Harmonization Group (OHG) agreements. The standard is
being developed by the two 3G Partnership Projects (3GPP and
3GPP2) and is being recognized as the CDMA part of IMT-2000 by
the International Telecommunications Union (ITU). The new
chipsets and systems software will pave the way for QUALCOMM CDMA
Technologies to deliver complete solutions to accelerate the
global deployment of 3G CDMA products and services.
The two FDD modes that will be implemented in the QUALCOMM
CDMA Technologies solutions are the G3G CDMA Multi-Carrier (MC)
mode, consisting of both 1x and 3x spreading bandwidths, and the
G3G CDMA Direct Spread (DS) mode. These solutions will enable
manufacturers and operators worldwide to easily and effectively
evolve their products and services based on local market
requirements and deliver a new breed of feature-rich, voice and
data-centric wireless devices furthering the growth of the
wireless industry.
"As the industry leader in on-time delivery of the most
advanced CDMA solutions for wireless handset and infrastructure
manufacturers, we are uniquely positioned to provide the most
complete 3G CDMA solutions," said Don Schrock, president of
QUALCOMM CDMA Technologies. "We are dedicated to delivering
leading CDMA chipset and system software solutions to meet the
requirements of operators and manufacturers around the world. We
intend to leverage our extensive experience with CDMA to enable
our customers to quickly bring to market products and services to
support the multiple modes of the single 3G CDMA standard."
Earlier this year, QUALCOMM CDMA Technologies introduced its
MSM5000(TM) chipset and system software solution that is
compliant with 3G CDMA 1x MC mode specifications. The MSM5000
chipset and system software, QUALCOMM CDMA Technologies' seventh-
generation MSM, is scheduled to begin field trials in early 2000
with commercial production following the trials.
In addition to the MSM5000, two new chipset and system
software solutions are currently being developed to support the
3G CDMA standard. The MSM5100(TM) chipset and system software
solution features support for the 1x and 3x MC mode while the
MSM5200(TM) chipset and system software will support the DS mode.
There will be significant amounts of commonality to facilitate
easy migration between different 3G CDMA modes as well as from
all existing QUALCOMM CDMA products to the new 3G products. With
the development of both MC and DS 3G CDMA technologies, QUALCOMM
CDMA Technologies will continue its leading position by
broadening its product portfolio to support manufacturers and
operators to successfully meet the worldwide 3G CDMA standard.
Both solutions will enable fast product development cycles,
improve power management, and provide extensive feature sets and
tools for product differentiation to allow flexibility in
targeting worldwide markets. Detailed specifications and
schedules will be announced later, paced by the specific backward
and forward migration paths as well as the system verification
and testing schedules of the different modes.
QUALCOMM CDMA Technologies is the leading developer and
supplier of CDMA chipsets, hardware and software solutions and
tools with more than 50 million MSM chips shipped worldwide. The
division supplies chipsets to the world's leading CDMA handset
and infrastructure manufacturers including: Acer Peripherals,
Inc., ALPS ELECTRIC CO., LTD.; CASIO COMPUTER CO., LTD.; DENSO
CORPORATION; FUJITSU LIMITED; Hitachi, Ltd.; Hyundai Electronics
Industries Co., Ltd.; KYOCERA CORPORATION; LG Information and
Communications, Ltd.; Samsung Electronics Ltd.; SANYO Electric
Co., Ltd.; and Toshiba Corporation, among others.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in
developing and delivering innovative digital wireless
communications products and services based on the Company's CDMA
digital technology. The Company's major business areas include
CDMA phones; integrated CDMA chipsets and system software;
technology licensing; and satellite-based systems including
OmniTRACS(R) and portions of the Globalstar(TM) system.
Headquartered in San Diego, Calif., QUALCOMM is included in the
S&P 500 Index and is a 1999 FORTUNE 500(R) company traded on the
Nasdaq under the ticker symbol QCOM.
Except for the historical information contained herein, this
news release contains forward-looking statements that are subject
to risks and uncertainties, including timely product development,
the Company's ability to successfully manufacture significant
quantities of CDMA or other equipment on a timely and profitable
basis, and those related to performance guarantees, change in
economic conditions of the various markets the Company serves, as
well as the other risks detailed from time to time in the
Company's SEC reports, including the report on Form 10-K for the
year ended September 26, 1999, and most recent Form 10-Q.
QUALCOMM is a registered trademark and OmniTRACS is a
registered trademark and service mark of QUALCOMM Incorporated.
MSM, MSM5000, MSM5100 and MSM5200 are trademarks of QUALCOMM
Incorporated. Globalstar is a trademark of Loral QUALCOMM
Satellite Services, Incorporated. All other trademarks are the
property of their respective owners. ots Original Text Service:
QUALCOMM Incorporated Internet: http://www.newsaktuell.de
Contact: Anita Hix, CDMA Technologies Marketing, 858-658-5879, or
fax, 858-651-7385, or ahix@qualcomm.com, or Christine Trimble,
Corporate Public Relations, 858-651-3628, or fax, 858-651-2590,
or ctrimble@qualcomm.com, or Julie Cunningham, Investor
Relations, 858-658-4224, or fax, 858-651-9303, or
jcunningham@qualcomm.com, all of QUALCOMM Web site:
http://www.qualcomm.com
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